● High speed up to 8000 MT/s
● Heat sink design enhances memory dissipation
● intel XMP 3.0 and AMD EXPO Support
● Compatibility with intel and AMD platforms
● Programmable RGB Lighting
● Carefully selected high-quality chips from
original manufacturers
● Meeting JEDEC standards
● Built-in Power Management IC
● Support On-die ECC error correction functionality
● High-quality PCB provides improved signal
transfer and system stability
General
| Unit Calculated Weight | 0.1633333 kg |
| Unit Calculated Volume | 0.0003949 cubm |
| Units per Shipping Box | 15 |
| Units per Pallet | 0 |
| Unit Box Height | 0.125 |
| Unit Box Length | 0.155 |
| Unit Box Width | 0.015 |
Features
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Backlight | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 30 |
| Component for | PC |
| Cooling type | Heatsink |
| ECC | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Internal memory | 32 GB |
| Internal memory type | DDR5 |
| Memory data transfer rate | 6000 MT/s |
| Memory form factor | 288-pin DIMM |
| Memory layout (modules x size) | 2 x 16 GB |
| Memory voltage | 1.35/1.4 V |
| On-Die ECC | Yes |
| Product colour | Black |
Operational conditions
| Operating temperature (T-T) | 0 - 85 °C |
Weight & dimensions
| Depth | 133.35 mm |
| Height | 7.7 mm |
| Weight | 110 g |
| Width | 37 mm |
Packaging data
| Package type | Box |
